Advanced Assembly Solutions

Precision Assembly for the Next Generation of Electronics

At AmpGuruX Technologies, we specialize in translating complex designs into fully functional electronic systems—bridging the gap between innovation and scalable production. From ultra-compact wearables to mission-critical electronics, our advanced assembly services empower product developers to realize their most ambitious visions with confidence.

Solving the Dual Demands of Modern Electronics

Today’s electronic products must deliver more functionality in less space—while remaining efficient, reliable, and durable. This challenge is amplified by the rise of edge computing, AI, and high-performance systems, which often require large-format circuit boards, high-speed interconnects, and superior thermal performance.

Traditional methods are no longer sufficient. That’s where our precision assembly capabilities come in.

Our Capabilities Include:

  • Advanced PCBA (Printed Circuit Board Assembly):
    Miniaturized assemblies using BGA (Ball Grid Array), QFN, and CSP (Chip Scale Packages) to ensure high-density component placement, better signal integrity, and optimized thermal dissipation.

  • Box Build & Final Assembly:
    End-to-end integration of electronic subassemblies, mechanical parts, and enclosures—ready for testing, packaging, and market deployment.

  • Custom Mechanical & Fluidic Assemblies:
    Expertise in combining electronics with human-machine interfaces, actuator mechanisms, acoustic elements, and microfluidic systems.

  • Adhesive & Encapsulation Technologies:
    Advanced adhesive solutions for bonding, conformal coating, thermal interface materials (TIMs), and potting—improving product robustness, heat transfer, and ingress protection.

  • Process Engineering & Design for Manufacturability (DFM):
    Collaborative engineering support to optimize your product design for high-yield manufacturing without sacrificing performance or aesthetics.

Why AmpGuruX?

  • Materials Innovation: We select and validate the right materials—whether thermally conductive adhesives, EMI shielding, or moisture-resistant coatings—to meet the unique demands of each device.

  • Precision Equipment & Processes: Our facilities support fine-pitch assembly, reflow soldering, 3D AOI inspection, and thermal profiling—ensuring every unit meets exacting quality standards.

  • Cross-Domain Expertise: Our assembly team understands electronics, mechanics, acoustics, and usability—resulting in seamless product integration across disciplines.


From Prototype to Scaled Production

Whether you’re launching a wearable medical device, a smart sensor, or a next-gen computing module, AmpGuruX Technologies delivers reliable, scalable assembly services designed to keep you ahead of market expectations. We don't just build products—we bring your innovation to life.